Rokko Marks 30 Years of Semiconductor R&D Breakthroughs https://www.eetasia.com/rokko-marks-30-years-of-semiconductor-rd-breakthroughs/ https://www.bloomberg.com/press-releases/2022-12-13/rokko-marks-30-years-of-r-d-breakthroughs Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Sputtering Processing and Apparatus” has been officially granted in United States Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Improved Net Block Assembly” has been officially granted in Singapore as Patent No. Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Integrated Circuit Singulation Method and System” has been officially granted in Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Apparatus and Method for Processing Sputtered IC Units” has been officially Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled ‘Improved Substrate Processing and Apparatus’ has been officially granted in China Continue Reading 

Rokko Leadframes Pte Ltd, the Leadframes division of Rokko Holdings Ltd is pleased to report that its patent related to manufacture of leadframes for electronics devices entitled "Semiconductor Device and Method Manufacture” has been officially Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled ‘Improved Substrate Processing and Apparatus’ has been officially granted in United Continue Reading 

Rokko Technology Pte Ltd, the Tooling division of Rokko Holdings Ltd is pleased to report that its patent related to tooling assembly system entitled “Assembly and Method for Improved Singulation” has been officially granted in Malaysia as Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC unit engagement “ has been officially granted in Continue Reading