Patent Granted for Apparatus and Method for Processing Sputtered IC Units
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Apparatus and Method for Processing Sputtered IC Units” has been officially granted in United States of America under the Patent No. 10,907,247.
United States of America Patent No. 10,907,247 will be valid for twenty years from the filing date 12 August 2015.