WELCOME TO ROKKO

We are a precision engineering group principally engaged in the business of providing automated equipment and precision engineering services to our customers in the semiconductor and electronics industries. We design and manufacture proprietary semiconductor assembly equipment, lead frames and precision tooling for use in the semiconductor industry, as well as undertake precision stamping of connectors for use in the electronics industry.

Latest News

  • Visit us at Semicon Southeast Asia, Penang, Malaysia, 21 – 23 June 2022 Venue: Setia SPICE Arena, Booth No.: A804  
  • Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled ‘Improved Substrate Processing and Apparatus’ has been officially granted in United States of America Patent No. 11,183,413. United States of America Patent Number: 11,183,413 will be enforceable for twenty years […]
  • Rokko Technology Pte Ltd, the Tooling division of Rokko Holdings Ltd is pleased to report that its patent related to tooling assembly system entitled “Assembly and Method for Improved Singulation” has been officially granted in Malaysia as Patent No. MY-180108-A Malaysia Patent No. MY-180108-A will have a life of twenty years from the filing date […]