WELCOME TO ROKKO

We are a precision engineering group principally engaged in the business of providing automated equipment and precision engineering services to our customers in the semiconductor and electronics industries. We design and manufacture proprietary semiconductor assembly equipment, lead frames and precision tooling for use in the semiconductor industry, as well as undertake precision stamping of connectors for use in the electronics industry.

Latest News

  • Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC unit engagement “ has been officially granted in Malaysia as Patent No. MY-178910-A. Malaysia Patent No. MY-178910-A will be enforceable for twenty years with priority […]
  • Rokko Technology, the Tooling division of Rokko Holdings is pleased to report that its patent related to tooling assembly system entitled ‘Punch Singulation System and Method’ has been officially granted in Singapore as Patent No.10201608682Y Singapore Patent No.10201608682Y shall be enforceable for twenty years from the date namely 28 September 2009.
  • Visit us at Semicon China 17 – 19 March 2021 Venue: Shanghai New International Expo Center at Hall E3, Booth# E3753