We are a precision engineering group principally engaged in the business of providing automated equipment and precision engineering services to our customers in the semiconductor and electronics industries. We design and manufacture proprietary semiconductor assembly equipment, lead frames and precision tooling for use in the semiconductor industry, as well as undertake precision stamping of connectors for use in the electronics industry.


Latest News
  • Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Apparatus and Method for Processing Sputtered IC Units” has been officially granted in United States of America under the Patent No. 10,907,247. United States of America Patent No. 10,907,247 […]
  • Visit us at Semicon Taipei, Taiwan, 14 – 16 September 2022 Venue: Tainex 1 Booth No.: L0900 – 4th Floor Please click the following link for more information : https://www.youtube.com/watch?v=gFz29Q0SqKY
  • Rokko Technology Sdn. Bhd. the Leadframes and Stamping Tools Manufacturing division of Rokko Holdings is pleased to report that it has received Quality Management Excellent Award from LRQA Malaysia for being certified to ISO 9001 for 20 years.