We are a precision engineering group principally engaged in the business of providing automated equipment and precision engineering services to our customers in the semiconductor and electronics industries. We design and manufacture proprietary semiconductor assembly equipment, lead frames and precision tooling for use in the semiconductor industry, as well as undertake precision stamping of connectors for use in the electronics industry.

Latest News

  • Visit us at Semicon China 17 – 19 March 2021 Venue: Shanghai New International Expo Center at Hall E3, Booth# E3753  
  • Rokko Launches 2nd Generation RS8000GTI Hybrid Jig Saw Machine Integrated with High Speed Pick and Place Vision Check To Meet Over 100K UPH Breakthrough. ROKKO is pleased to share with all our valued customers our 2nd Generation-RS8000GTI (Gen2-8000GTI) Jig Saw Singulation System with enhanced Hybrid dicing and sorting capabilities for Leadless packages like QFN, DFN […]
  • Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled ‘System and Method for Engaging Singulated Substrates’ has been officially granted in Republic of the Philippines Patent No. 1-2010-501238. Republic of the Philippines Patent Number: 1-2010-501238 will be enforceable for […]