WELCOME TO ROKKO
We are a precision engineering group principally engaged in the business of providing automated equipment and precision engineering services to our customers in the semiconductor and electronics industries. We design and manufacture proprietary semiconductor assembly equipment, lead frames and precision tooling for use in the semiconductor industry, as well as undertake precision stamping of connectors for use in the electronics industry.
RECENT POSTS
Latest News-
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for IC unit Singulation and Sorting “ has been officially granted in United States of America Patent No. 11,791,183. United States of America Patent No. 11,791,183 will […]
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Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled ‘Improved Substrate Processing and Apparatus’ has been officially granted in Malaysia Patent No. MY-198165-A. Malaysia Patent Number: MY-198165-A will be enforceable for twenty years with priority date of 17 Nov […]
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Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Unit Unloading System” has been officially granted in United States as Patent No. 11,706,875. United States of America Patent No. 11,706,875 will have a life of twenty years from the […]