Designs, develops and manufactures precision tools and dies for use in the front-end and back-end processes in the semiconductor chips assembly. The “front-end” assembly process involves die bonding and wire bonding processes whereas the “back-end” process involves the mold packaging, singulation and the final testing of fully assembled semiconductor chips.
Diesets for Stamping Machines
Tools & Dies Range
Window Clamps for Bonding Machines
Heater Blocks for Bonding Machines
Pot & Plunger for Automold Machines
Picker Rubber Panels & Insert Type