Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC unit engagement “ has been officially granted in Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for PCB Sawing” has been officially granted in Continue Reading 

Rokko Marks 30 Years of Semiconductor R&D Breakthroughs https://www.eetasia.com/rokko-marks-30-years-of-semiconductor-rd-breakthroughs/ https://www.bloomberg.com/press-releases/2022-12-13/rokko-marks-30-years-of-r-d-breakthroughs Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Sputtering Processing and Apparatus” has been officially granted in United States Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Improved Net Block Assembly” has been officially granted in Singapore as Patent No. Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Integrated Circuit Singulation Method and System” has been officially granted in Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Apparatus and Method for Processing Sputtered IC Units” has been officially Continue Reading