Patent Granted for Integrated Circuit Singulation Method and System

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Integrated Circuit Singulation Method and System” has been officially granted in Singapore as Patent No.  10201702004S. The Singapore Patent No. 10201702004S will have a life of twenty years from the application date 12 Sep 2013.