Patent Granted for Improved Substrate Processing and Apparatus

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled ‘Improved Substrate Processing and Apparatus’ has been officially granted in United States of America Patent No. 11,183,413.

United States of America Patent Number: 11,183,413 will be enforceable for twenty years with priority date of 18 Nov 2016.