Semicon China 2017
Visit us at Semicon China 14th – 16th Mar, 2017 Venue: Shanghai New International Expo Center at Hall W5, Booth# 4375Continue Reading
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Patent Granted for Assembly and Method for Improved Singulated
Rokko Technology Pte Ltd, the Tooling division of Rokko Holdings Ltd is pleased to report that its patent related to tooling assembly system entitled “Assembly and Method for Improved Singulated” has been officially granted in Philippines as Continue Reading
Patent Granted for Assembly and Method for IC Unit Engagement
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC Unit Engagement” has been officially granted in Continue Reading
Patent Granted for a System and Process for Dicing Integrated Circuits
Rokko Ventures Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Processing of Integrated Circuit Units product entitled ‘A System and process for dicing Integrated Circuits’ has Continue Reading
Semicon Taiwan 2016
Visit us at Semicon Taiwan 07th – 09th Sep, 2016 Venue: TWTC, Nangang Hall, Taipei, Taiwan 4th Floor Booth# 907Continue Reading
Patent Granted for Assembly and Method for IC Unit Engagement
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC Unit Engagement” has been officially granted in Continue Reading
Patent Granted for “Method and Apparatus for the engagement of IC units”
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for the engagement of IC units” has been officially Continue Reading
Patent Granted for Method and Apparatus for Improved Sorting of Diced Substrates
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for Improved Sorting of Diced Substrates” has been Continue Reading
Semicon Southeast Asia 2016
Visit us at Semicon China 26th – 28th Apr, 2016 Venue: SPICE Arena Penang, Malaysia, Booth# 814Continue Reading
Patent Granted for Assembly and Method for IC Unit Engagement
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC Unit Engagement” has been officially granted in People’s Continue Reading