Rokko Ventures Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Processing of Integrated Circuit Units product entitled ‘A System and process for dicing Integrated Circuits’ has Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC Unit Engagement” has been officially granted in Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for the engagement of IC units” has been officially Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for Improved Sorting of Diced Substrates” has been Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC Unit Engagement” has been officially granted in People’s Continue Reading 

Rokko Leadframes, the Leadframes division of Rokko Holdings is pleased to report that its patent related to manufacture of leadframes for electronics devices entitled ‘A Method for plating a component’ has been officially granted in Singapore as Continue Reading 

Rokko Materials, the Leaframes division of Rokko Holdings is pleased to report that its patent related to manufacture of leadframes for electronics devices entitled ‘Leadframe Manufacture’ has been officially granted in Singapore as Patent No. Continue Reading