Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Improved Dry Block Assembly” has been officially granted in Singapore as Patent No. Continue Reading
Visit us at Semicon South East Asia 07th – 09th May, 2019. Venue: MITEC , Level 1 Hall 2 & Hall 3, Kuala Lumpur, Malaysia (Booth #807) Continue Reading
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “A Unit Lifter Assembly” has been officially granted in Thailand under the Continue Reading
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC unit engagement “ has been officially granted in South Continue Reading
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for Improved Sorting of Diced Substrates” has been Continue Reading