Patent Granted for Apparatus and Method for Processing Sputtered IC Units
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Apparatus and Method for Processng Sputtered IC Units” has been officially granted in Singapore under the Patent No. 10201404879U.
Singapore Patent No. 10201404879U will be valid for twenty years from the filing date 13 March 2014.