Patent Granted for Apparatus and Method for Processing Sputtered IC Units
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Apparatus and Method for Processng Sputtered IC Units” has been officially granted in Taiwan under the Patent No. I 690612.
Taiwan Patent No. I 690612 will be valid for twenty years from the filing date 13 Aug 2015.