Patent Granted for Assembly and Method for IC Unit Engagement

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assemby and Method for IC Unit Engagement ” has been officially granted in South Korea Patent No. 10-1793563

The South Korea Patent No.10-1793563 shall be enforceable for twenty years from the date namely 23 December 2010.