Patent Granted for Method and Apparatus for Solder Ball Placement
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Ball Mounting System product entitled “Method and Apparatus for the Solder Ball Placement” has been officially granted in Singapore under the Patent No. 10201508043V.
Singapore Patent No. 10201508043V will be valid for twenty years from the filing date 24 June 2008.