Patent Granted for Assembly and Method for IC Unit Engagement

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC Unit Engagement” has been officially granted in Taiwan as Patent No. I557833.
Taiwan Patent No. I557833 will have a life of twenty years from the filing date 23 December 2010.