Patent Granted for Method and Apparatus for solder Ball placement

Rokko Ventures Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that the patent related to its flagship Ball Mounting System entitled “Method and Apparatus for solder Ball placement” has been officially granted in Singapore as Patent No. 157985.

The Singapore Patent Number: 157985 with priority date of 24th June 2008 shall be enforceable for twenty years from that date.