Patent Granted for Assembly and Method for IC unit engagement

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC unit engagement “ has been officially granted in Japan as Patent No. 5674811. The Japan Patent No. 5674811 will be enforceable for twenty years with priority date of 23 Dec 2010.