Assembly and Method for IC Unit Engagement

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC Unit Engagement” has been officially granted in United States of America as Patent No. US 8,997,592 B2.

The US Patent Number: US 8,997,592 B2 will have a life of twenty years and 319 days dated from the application date 25 June 2012.