Patent Granted for Assembly and Method for IC Unit Engagement

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC Unit Engagement” has been officially granted in People’s Republic of China as Patent No. ZL 2010 8 0059262.5

The term of this People’s Republic of China Patent is twenty years beginning from the filing date 23 Dec 2010.