Rokko Materials, the Leaframes division of Rokko Holdings is pleased to report that its patent related to manufacture of leadframes for electronics devices entitled ‘Leadframe Manufacture’ has been officially granted in Singapore as Patent No. Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC Unit Engagement” has been officially granted in United Continue Reading 

Rokko Systems, the Auto Vision and Robotics segment today announced the mass production machine for Electromagnetic Interference (EMI) Shielding and Sorting Process product, the Aztec Model. It is a series of Pick and Place machine with ability Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for Improved Sorting of Diced Substrates” has been officially Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC unit engagement “ has been officially granted in Japan Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Ball mounting system in Integrated Circuits entitled ‘An improved Ball Mounting Apparatus and Method’ has been Continue Reading 

Rokko Technology, the Tooling division of Rokko Holdings Ltd is pleased to report that its patent related to tooling assembly system entitled “ Assembly and Method for Improved Singulation “ has been officially granted in People’s Republic Continue Reading 

Rokko Ventures Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Processing of Integrated Circuit Units product entitled “System and method for Offloading IC units” has been Continue Reading