Patent Granted for Method and Apparatus for IC unit Singulation and Sorting

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for IC unit Singulation and Sorting “ has been officially granted in Taiwan Patent No.I820522.
Taiwan Patent No.I820522 will be enforceable for twenty years with priority date of 24 Nov 2021.