Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Picker Assembly and Method Operation” has been officially granted in Singapore Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled ‘Supply Mechanism for the chuck of an integrated circuit dicing device’ has been Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Apparatus and Method for Processng Sputtered IC Units” has been officially Continue Reading 

Rokko Leadframes, the Leadframes division of Rokko Holdings is pleased to report that its patent related to manufacture of leadframes for electronics devices entitled ‘Semiconductor Device and Method of Manufacture’ has been officially granted Continue Reading 

Rokko Leadframes, the Leadframes division of Rokko Holdings is pleased to report that its patent related to manufacture of leadframes for electronics devices entitled ‘A Method for plating a component’ has been officially granted in Singapore as Continue Reading 

Dear Business Partners, We would like to thank everyone that has given us the unwavering business support during this extraordinary time and we would like to give a brief update on the impact of the COVID-19 pandemic on our business continuity Continue Reading 

Dear Business Partners, We would like to thank everyone that has given us the unconditional support for our Business Continuity Plan during this extraordinary time and we would like to give a brief update on the impact of COVID-19 pandemic on Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Apparatus and Method for Processng Sputtered IC Units” has been officially Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Apparatus and Method for Processing Sputtered IC Units” has been officially Continue Reading