Patent Granted for A System and Method for Selective Unloading of IC Packages

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “A System and Method for Selective Unloading of IC Packages” has been officially granted in Taiwan Patent No. I927064
Taiwan Patent No.I927064 shall be enforceable for twenty years from the date namely 06 April 2022.