Patent Granted for Supply Mechanism of an integrated Circuit Dicing Device

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled ‘Supply Mechanism for the chuck of an integrated circuit dicing device’ has been officially granted in South Korea as Patent No. 10-1299322. The South Korea Patent Number: 10-1299322 will be enforceable for twenty years with priority date of 23 August 2005.