Patent Granted for Assembly and Method for IC Unit Engagement

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings, is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC Unit Engagement” has been officially granted in Singapore as Patent No. 172499.
The Singapore Patent No. 172499 will have a life of twenty years from the application date 23 December 2009.