Semicon Taiwan 2016
Visit us at Semicon Taiwan 07th – 09th Sep, 2016 Venue: TWTC, Nangang Hall, Taipei, Taiwan 4th Floor Booth# 907Continue Reading
Patent Granted for Assembly and Method for IC Unit Engagement
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC Unit Engagement” has been officially granted in Continue Reading
Patent Granted for “Method and Apparatus for the engagement of IC units”
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for the engagement of IC units” has been officially Continue Reading
Patent Granted for Method and Apparatus for Improved Sorting of Diced Substrates
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for Improved Sorting of Diced Substrates” has been Continue Reading
Semicon Southeast Asia 2016
Visit us at Semicon China 26th – 28th Apr, 2016 Venue: SPICE Arena Penang, Malaysia, Booth# 814Continue Reading
Patent Granted for Assembly and Method for IC Unit Engagement
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC Unit Engagement” has been officially granted in People’s Continue Reading
Semicon China 2016
Visit us at Semicon China 15th – 17th Mar, 2016 Venue: Shanghai New International Exhibition Centre (SNIEC) at Hall N5, Booth# 5711Continue Reading
Patent Granted for A method for plating a component
Rokko Leadframes, the Leadframes division of Rokko Holdings is pleased to report that its patent related to manufacture of leadframes for electronics devices entitled ‘A Method for plating a component’ has been officially granted in Singapore as Continue Reading
Patent Granted for Leadframe Manufacture
Rokko Materials, the Leaframes division of Rokko Holdings is pleased to report that its patent related to manufacture of leadframes for electronics devices entitled ‘Leadframe Manufacture’ has been officially granted in Singapore as Patent No. Continue Reading
Assembly and Method for IC Unit Engagement
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC Unit Engagement” has been officially granted in United Continue Reading
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