Patent Granted for Assembly and Method for IC Unit Engagement

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC Unit Engagement” has been officially granted in Republic of the Philippines as Patent No. 1-2012-501259
The Republic of the Philippines Patent No. 1-2012-501259 will have a life of twenty years from the filing date 20 June 2012.