Patent Granted for Supply Mechanism for the chuck of an integrated Circuit dicing device
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Supply Mechanism for the chuck of an Integrated Circuit dicing device” has been officially granted in Japan as Patent No. 5140428. The Japan Patent No. 5140428 will have a life of twenty years from the application date 23 August 2005.