SSIA Semiconductor Annual Dinner 2024.
Please click the following link for more information : https://ssia.org.sg/ssia-summit-semiconductor-dinner/Continue Reading
Have a question?
Call our staff OR drop us an email
Semicon Show India 2024
Visit us at Semicon Show India, 11 Sep – 13 Sep 2024 Venue: IEML, Greater Noida, India. Booth No.: H3N14 (Hall 3) Please click the following link for more information : Youtube https://youtu.be/xIyUKa06VfgContinue Reading
Semicon Show Taiwan 2024
Visit us at Semicon Show Taiwan, 04 Sep – 06 Sep 2024 Venue: TaiNEX 1&2, Taipei. Booth No.: M0848 (Hall 1) Please click the following link for more information : Youtube https://youtu.be/7VDbTlgyJxU Please click the following link for Continue Reading
Press Release: 23 August 2024 marks the 20th anniversary of the first patent filing for ROKKO 1st-generation RS-7000 Jig Saw machine.
Today, we are proud to celebrate 20 years of pioneering innovation! The remarkable RS-7000 series, with its successor – the RS-8000 series Jig Saw machines had redefined the standards in IC packaging productivity and reinforced Rokko’s Continue Reading
Semicon Show SEA 2024
Visit us at Semicon Show SEA, 28 May – 30 May 2024 Venue: MITEC Kuala Lumpur. Booth No.: 1312 (Hall 2-4) Please click the following link for more information : Youtube https://youtu.be/VQhb9_FfuCc Please click the following link for more Continue Reading
Patent Granted for System and Method for Unloading IC Units
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “System and Method for Unloading IC Units” has been officially granted in Malaysia Continue Reading
Semicon Show China 2024
Visit us at Semicon Show China, 20 Mar – 22 Mar 2024 Venue: Shanghai New International Expo Centre. Booth No.: N3753 Please click the following link for more information : Youtube https://youtu.be/NUchEBkOkmw Please click the following Continue Reading
Patent Granted for Improved Sputtering Processing and Apparatus
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Improved Sputtering Processing and Apparatus” has been officially granted in Taiwan Continue Reading
Patent Granted for Method and Apparatus for IC unit Singulation and Sorting
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for IC unit Singulation and Sorting “ has been officially Continue Reading
Patent Granted for Method and Apparatus for IC unit Singulation and Sorting
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for IC unit Singulation and Sorting “ has been officially Continue Reading