Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Supply Mechanism for the Chuck of an Integrated Circuit dicing device” has been officially granted in Malaysia as Patent No. MY-146842-A.

The Malaysia Patent No. MY-146842-A will have a life of twenty years from the application date 23 August 2005.