Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for the engagement of IC units” has been officially granted in Singapore as Patent No. 196693. The Singapore Patent Number 196693 will be enforceable for twenty years with priority date of 20 July 2012. Please refer to the attached PDF file for more about the Patent.