Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled ‘Supply Mechanism for the Chuck of an integrated Circuit Dicing Device’ has been officially granted in United States as Patent No. US 7939374 B2.

The United Stated Patent Number : US 7939374 B2 with priority date of 23rd August 2004, shall be enforceable for twenty years from the application date 23 February 2007.