Patent Granted for Method and Apparatus for Improved Sorting of Diced Substrates
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for Improved Sorting of Diced Substrates” has been officially granted in Malaysia under Patent No. MY-165481-A
The Malaysia Patent No.MY-165481-A shall be enforceable for twenty years from the 30 November 2010 onwards.
