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Patent Granted for Unit Unloading System

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News
Posted on 14 Sep, 2023

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Unit Unloading System” has been officially granted in United States as Patent No. Continue Reading

SSIA Summit 2023 and Semiconductor 55 Dinner-SSIA

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Events
Posted on 12 Sep, 2023

Celebrating an incredible 55 years of Singapore’s outstanding contributions to the Semiconductor Industry and the global community. We warmly invite you to be part of this celebration. Join us at: Continue Reading

Patent Granted for Unit Unloading System

By admin
News
Posted on 8 Aug, 2023

Semicon Show Taiwan 2023

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Events
Posted on 8 Aug, 2023

Visit us at Semicon Show Taiwan, 6 Sep – 8 Sep 2023 Venue: 4th Floor, Hall 1, TaiNex, Booth No.: L0310 Please click the following link for more information : Youtube https://www.youtube.com/watch?v=Ic965Qx_ZnY Please click the following Continue Reading

Patent Granted for Method and Apparatus for PCB Washing

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News
Posted on 30 Jun, 2023

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for PCB Washing” has been officially granted in China as Continue Reading

Semicon China 2023

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Events
Posted on 23 Jun, 2023

Visit us at Semicon Show China, 29 Jun – 01 Jul 2023 Venue: Shanghai New International Expo Centre. Booth No.: E3350 Please click the following link for more information : Youtube https://www.youtube.com/watch?v=b_CP6kVs-h0 Please click Continue Reading

Semicon SEA 2023

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Events
Posted on 5 May, 2023

Visit us at Semicon SEA, Penang Malaysia, 23 – 25 May 2023 Venue: Setia Spice Arena and Convention Center Booth No.: A708 Please click the following link for more information : Youtube https://www.youtube.com/watch?v=1SZqP2q1a5U Please click the Continue Reading

Patent Granted for Assembly and Method for IC unit engagement

By admin
News
Posted on 14 Feb, 2023

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC unit engagement “ has been officially granted in Continue Reading

Patent Granted for Method and Apparatus for PCB Sawing

By admin
News
Posted on 29 Dec, 2022

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for PCB Sawing” has been officially granted in Continue Reading

Press Release: Commemoration of Rokko 30th Anniversary

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News
Posted on 13 Dec, 2022

Rokko Marks 30 Years of Semiconductor R&D Breakthroughs https://www.eetasia.com/rokko-marks-30-years-of-semiconductor-rd-breakthroughs/ https://www.bloomberg.com/press-releases/2022-12-13/rokko-marks-30-years-of-r-d-breakthroughs Continue Reading

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