Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for IC unit Singulation and Sorting “ has been officially granted in United States of America Patent No. 11,791,183.
United States of America Patent No. 11,791,183 will be enforceable for twenty years with priority date of 13 Dec 2021.