Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled ‘System and method for dicing substrates to produce sorted singulated units’ has been officially granted in People’s Republic of China as Patent number: ZL 2008 1 0189698.0.

The People’s Republic of China Patent number: ZL 2008 1 0189698.0 with priority date of 23 August 2005 shall be enforceable for twenty years.