Patent Granted for A Method for Plating A Component

Rokko Leadframes, the Leadframes division of Rokko Holdings is pleased to report that its patent related to manufacture of leadframes for electronics devices entitled ‘A Method for plating a component’ has been officially granted in Singapore as Patent No. 10201506670S

Singapore Patent No. 10201506670S  shall be enforceable for twenty years from the date namely 24 February 2012.