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FX300+ Fully Automatic Ball Mounter System
Key Features
- Fastest cycle time 7.2 second / strip
- Handle wide format substrate (80mm width) with high accuracy vision guided placement
- Proprietary rotator with dual WIP technology to give both speed and placement repeatability
- Compact and small footprint without compromise on accessibility and ease of maintenance
- Advanced After-Mount Inspection to handle Next Generation High Density Packages
- Best Cost of Ownership for high volume production
Specifications
- UPH – 500 strips / hour with Full vision alignment (0.3mm solder ball)
- Solder ball size – 0.2mm to 0.76mm
- Pitch – 0.4mm to 1.27mm
- Substrate size – 260 x 80mm
- Ball counts – 25,000@0.3mm solder balls
Have a question?
Call our staff OR drop us an email