Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Apparatus and Method for Processing Sputtered IC Units” has been officially granted in China under the Patent No. ZL 2015800545913.
China Patent No. ZL 2015800545913 will be valid for twenty years from the filing date 24 September 2019.