Patent Granted for System and process for dicing Integrated Circuits

Rokko Ventures Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled ‘A System and process for dicing integrated Circuits’ has been officially granted in Singapore as Patent No. 156539.

The Singapore Patent Number: 156539 with priority date of 14th April 2008 shall be enforceable for twenty years from that date.