We are a precision engineering group principally engaged in the business of providing automated equipment and precision engineering services to our customers in the semiconductor and electronics industries. We design and manufacture proprietary semiconductor assembly equipment, lead frames and precision tooling for use in the semiconductor industry, as well as undertake precision stamping of connectors for use in the electronics industry.

Latest News

  • Visit us at Semicon Taiwan 05th – 07th Sep, 2018 Venue: TWTC, Nangang Hall, Taipei, Taiwan 4th Floor Booth# :L700
  • Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for Improved Sorting of Diced Substrates” has been officially granted in Malaysia Patent No. MY-165481-A The Malaysia Patent No.MY-165481-A shall be enforceable for twenty years from […]
  • Visit us at Semicon South East Asia 22nd – 24th May, 2018. Venue: MITEC , Level 1 Hall 2 & Hall 3, Kuala Lumpur, Malaysia (Booth #512)