We are a precision engineering group principally engaged in the business of providing automated equipment and precision engineering services to our customers in the semiconductor and electronics industries. We design and manufacture proprietary semiconductor assembly equipment, lead frames and precision tooling for use in the semiconductor industry, as well as undertake precision stamping of connectors for use in the electronics industry.

Latest News

  • Visit us at Semicon China 20 – 22 Mar, 2019 Venue: Shanghai New International Expo Center at Hall N3, Booth# 3779  
  • Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC unit engagement “ has been officially granted in South Korea as Patent No. 10-1889437. The South Korea Patent No. 10-1889437 will be enforceable for twenty […]
  • Visit us at Semicon Taiwan 05th – 07th Sep, 2018 Venue: TWTC, Nangang Hall, Taipei, Taiwan 4th Floor Booth# :L700