Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “System and Method for dicing integrated Circuits” has been officially granted in the People Republic of China as Patent No. ZL 2010 1 0150123.5
The China Patent No. ZL 2010 1 0150123.5 will have a life of twenty years from the application date 23 August 2005.