Patent Granted for Assembly and Method for IC unit engagement
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC unit engagement “ has been officially granted in Malaysia as Patent No. MY-178910-A.
Malaysia Patent No. MY-178910-A will be enforceable for twenty years with priority date of 23 Dec 2010.