Patent Granted for Supply Mechanism for the Chuck of an Integrated Circuit Dicing Device
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled ‘Supply Mechanism for the chuck of an integrated circuit dicing device’ has been officially granted in Thailand as Patent No. 73412.
Thailand Patent No. 73412 will be enforceable for twenty years with priority date of 23 August 2005.
