Patent Granted

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled ‘Supply Mechanism for the Chuck of an integrated Circuit Dicing Device’ has been officially granted in Singapore.

The Singapore Patent Number : 129946 with priority date of 23rd August 2004, shall be enforceable for twenty years from 23 August 2005.