Rokko Launches Its IPO at S$0.25 Per Share

Singapore, October 18, 2007 – Rokko Holdings Ltd. (“洛科集团有限公司”) (“Rokko” or the “Group”), a provider of automated equipment and precision engineering services, today registered its prospectus (the “Prospectus”) with the Monetary Authority of Singapore. The Group is launching its initial public offering (“IPO”) of 30 million New Shares at S$0.25 each, in connection with its listing on the SGX-ST Dealing and Automated Quotation System (“SGX-SESDAQ”).

Rokko designs, develops and manufactures semiconductor assembly equipment and precision tools for the semiconductor industry as well as undertakes precision stamping of connectors for use in the electronics industry. Its major customers are global players in the semiconductor and electronics industries, such as the Texas Instruments group of companies and United Test and Assembly Center Ltd.

Said Mr Gary Lim Chong Chen (林仲振), founder and Managing Director of Rokko: “We have a business model combining tooling, equipment and stamping services. This competitive edge allows us to serve both the semiconductor and electronics industries.

Research and development is one of our success factors. Our R&D activities have enabled us to innovate and develop advanced automated equipment, which are marketed under our proprietary “Rokko” and “Finix” brands. We will continue to invest in R&D to stay at the forefront of technology.

Rokko has long standing working relationships with many of our customers; some have been with our company for ten years or more. Our ability to provide products with new technology and services coupled with an experienced management team will continue to be important factors in attracting and retaining customers.”


Use of Proceeds

Rokko plans to use the net proceeds of approximately S$6.2 million from the issue of New Shares as follows:

  • Expansion of production capacity for its Stamping and Tooling Divisions
  • Development of new products
  • Acquisitions, joint ventures and/or strategic alliances for expansion of its business, and for working capital purposes


The Invitation

The Invitation in respect of 30 million New Shares comprises:

  1. 2 million Offer Shares at S$0.25 each by way of public offer; and
  2. 28 million Placement Shares by way of placement, comprising: –
    1. 23 million Placement Shares at S$0.25 for each Placement Share for application by way of Placement Shares Application Forms; and
    2. 5 million Reserved Shares at S$0.25 for each Reserved Share reserved for its Directors, management and employees.

Based on an issue price of S$0.25, Rokko’s IPO is priced at a price earnings ratio of 7.0 times based on the historical earnings per share for the financial year ended 31 December 2006 and a pre-invitation share capital of 120 million shares.

The public offer will open on 19 October 2007, and will close at 12 noon on 25 October 2007. Listing and trading of Rokko’s shares on the SGX-SESDAQ is expected to commence at 9.00 a.m. on 29 October 2007.


Corporate Profile

Established in 1992, the Group currently provides automated equipment and precision engineering services to customers in the semiconductor and electronics industries. The Group has 3 main business segments – Equipment – the design, development and manufacturing of automated equipment and marketing it under the proprietary “Rokko” and “Finix” brands, Tooling – the design, development and manufacturing of precision tools used in the front-end and back-end processes in the semiconductor manufacturing process, and Stamping – the provision of connector stamping services, as sub-contractors, to manufacturers in the electronics industry. The Group, with manufacturing facilities in Singapore and Malaysia and a presence in Indonesia, has a global customer base stretching from South East Asia to North Asia and some parts of Europe.



The Asia Pacific is expected to remain a key region for semiconductor activities, with South East Asia and North Asia continuing to be important semiconductor hubs. The Group intends to capitalise on its strategic location in Asia to tap on the advantage of its proximity to renowned semiconductor assembly and testing service providers in the region, to grow its business.

As at the Latest Practicable Date (30 August 2007), the Group has already secured orders amounting to S$7.3 million for delivery within the next two months.

With continuous advancement in technology, and the constant race towards development of new consumer electronic products, the Group is optimistic that the Tooling Division would continue to provide a steady revenue stream.


Financial Highlights

The Group’s revenue increased from approximately S$8.2 million in FY2004, to approximately S$30.0 million in FY2006. Its profit after taxation attributable to equity holders of the Company increased from approximately S$0.7 million in FY2004 to approximately S$4.3 million in FY2006.

China Construction Bank Corporation, Singapore Branch, is the Manager, Underwriter and Placement Agent for the IPO.