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Designs, develops and manufactures precision tools and dies for use in the front-end and back-end processes in the semiconductor chips assembly. The “front-end” assembly process involves die bonding and wire bonding processes whereas the “back-end” process involves the mold packaging, singulation and the final testing of fully assembled semiconductor chips.

Trim & form diesets design & fabrications.
Custom made precision indexing pins & gages.
Diamond film coating & diamond wheels supply.
Special high speed steels and carbide material supply.
Custom made carbide tools and trim and form spares support for high pin count and sophisticated trim and form diesets.
New diesets and new products design development with in-house R&D capabilities.
Trim and form diesets conversion & refurbishment work.
Automold Components.
Wire Bonder Components.
Diesets for Stamping Machines
Diesets for Stamping Machines
Tools & Dies Range
Tools & Dies Range
Window Clamps for Bonding Machines
Window Clamps for Bonding Machines
Heater Blocks for Bonding Machines
Heater Blocks for Bonding Machines
Connector Dies
Connector Dies
Pot & Plunger for Automold Machines
Pot & Plunger for Automold Machines
Picker Rubber Panels & Insert Type
Picker Rubber Panels & Insert Type
Have a question?

Call our staff OR drop us an email