Patent Granted for Method and Apparatus for Improved Sorting of Diced Substrates

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for Improved Sorting of Diced Substrates” has been officially Continue Reading 

Patent Granted for Supply Mechanism for the chuck of an integrated Circuit Dicing Device

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled ‘Supply Mechanism for the chuck of an integrated circuit dicing device’ Continue Reading 
1
2
3
4
5
6
7
8
9
10
11
12