Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for Improved Sorting of Diced Substrates” has been officially granted in United States of America as Patent No. US 8,890,018 B2

The US Patent Number: US 8,890,018 B2 will have a life of twenty years and 70 days dated from the application date 30 Nov 2010.