Patent Granted for Supply Mechanism for the Chuck of an integrated Circuit Dicing Device

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled ‘Supply Mechanism for the Chuck of an integrated Circuit Dicing Continue Reading 

Patent Granted for Supply Mechanism for the Chuck of an integrated Circuit Dicing Device

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled ‘Supply Mechanism for the Chuck of an integrated Circuit Dicing Continue Reading 

Patent Granted for Supply Mechanism for the Chuck of an integrated Circuit Dicing Device

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled ‘Supply Mechanism for the Chuck of an integrated Circuit Dicing Continue Reading 

Patent Granted for System and method for dicing substrates to produce sorted singulated units

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled ‘System and method for dicing substrates to produce sorted singulated units’ has Continue Reading 
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