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FX300+ Fully Automatic Ball Mounter System
FX300

Key Features

  • Fastest cycle time 7.2 second / strip
  • Handle wide format substrate (80mm width) with high accuracy vision guided placement
  • Proprietary rotator with dual WIP technology to give both speed and placement repeatability
  • Compact and small footprint without compromise on accessibility and ease of maintenance
  • Advanced After-Mount Inspection to handle Next Generation High Density Packages
  • Best Cost of Ownership for high volume production

Specifications

  • UPH – 500 strips / hour with Full vision alignment (0.3mm solder ball)
  • Solder ball size – 0.2mm to 0.76mm
  • Pitch – 0.4mm to 1.27mm
  • Substrate size – 260 x 80mm
  • Ball counts – 25,000@0.3mm solder balls
Have a question?

Call our staff OR drop us an email